Method and apparatus for processing wafer-shaped articles

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8691022
SERIAL NO

13718901

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Abstract

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The wet treatment of wafer-shaped articles is improved by utilizing a droplet generator designed to produce a spray of monodisperse droplets. The droplet generator is mounted above a spin chuck, and is moved across a major surface of the wafer-shaped article in a linear or arcuate path. The droplet generator includes a transducer acoustically coupled to its body such that sonic energy reaches a region of the body surrounding the discharge orifices. Each orifice has a width w of at least 1 μm and at most 200 μm and a height h such that a ratio of h to w is not greater than 1.

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Patent Owner(s)

  • LAM RESEARCH AG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Holsteyns, Frank Kortenberg, AT 12 69
Lippert, Alexander Villach, AT 12 40

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