Method and device for thermocompression bonding
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United States of America Patent
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Apr 8, 2014
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N/A
app pub date -
Oct 11, 2011
filing date -
Oct 18, 2010
priority date (Note) -
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Abstract
There are provided a method and device for thermocompression bonding of possibly preventing any warping of a resin member to be caused by thermocompression bonding, and of possibly reducing the time to be taken for processing. The method for thermocompression bonding, includes: preheating a resin member using an infrared radiation section; and subjecting the resin member to thermocompression bonding using a heating section and a pressurization section.
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