Semiconductor device and method for manufacturing the same

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United States of America Patent

PATENT NO 8692364
SERIAL NO

13389234

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Abstract

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A semiconductor device includes an embedding layer in which one or more semiconductor element(s) is embedded and one or more interconnect layers as well as one or more insulation layers on one or both sides of the embedding layer. The embedding layer includes a woven cloth formed by reinforcement fibers. The woven cloth has an opening on its site embedding the semiconductor element. The opening is arranged so that direction of the reinforcement fibers will have a preset angle with respect to a direction of a side of or a tangent to at least a portion of the opening, the preset angle being other than a square angle or a zero angle (parallelism).

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Patent Owner(s)

  • NEC CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kikuchi, Katsumi Tokyo, JP 129 2090
Mori, Kentaro Tokyo, JP 169 1265
Nakashima, Yoshiki Tokyo, JP 43 518
Yamamichi, Shintaro Tokyo, JP 90 2230

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