Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof
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United States of America Patent
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Apr 8, 2014
Grant Date -
Dec 20, 2012
app pub date -
Jun 17, 2011
filing date -
Jun 17, 2011
priority date (Note) -
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a package stack assembly, having a contact pad, on the base substrate; applying an encapsulation having a cavity with a tapered side directly over the package stack assembly, the contact pad exposed in the cavity; attaching a recessed circuitry unit in the cavity and on the contact pad, a chamber of the cavity formed by the recessed circuitry unit and the tapered side of the cavity; and mounting a thermal structure over the recessed circuitry unit, the cavity, and the encapsulation.
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