Integrated circuit packaging system with plated leads and method of manufacture thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8692377
APP PUB NO 20120241966A1
SERIAL NO

13069744

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Abstract

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An integrated circuit packaging system and method of manufacture thereof includes: an L-plated lead; a die conductively connected to the L-plated lead; and an encapsulant encapsulating the L-plated lead and the die.

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTE.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bathan, Henry Descalzo Singapore, SG 113 950
Camacho, Zigmund Ramirez Singapore, SG 173 1461
Tay, Lionel Chien Hui Singapore, SG 116 1739

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