Dicing tape-integrated film for semiconductor back surface
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United States of America Patent
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Apr 8, 2014
Grant Date -
Jun 30, 2011
app pub date -
Dec 22, 2010
filing date -
Dec 24, 2009
priority date (Note) -
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Abstract
The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which a peel force (temperature: 23° C., peeling angle: 180°, tensile rate: 300 mm/min) between the pressure-sensitive adhesive layer of the dicing tape and the film for flip chip type semiconductor back surface is from 0.05 N/20 mm to 1.5 N/20 mm.
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