Semiconductor device cooling module

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United States of America Patent

PATENT NO 8693200
APP PUB NO 20130199752A1
SERIAL NO

13368031

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Abstract

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A cooling module for cooling a semiconductor is provided and includes a land grid array (LGA) interposer, a substrate with an LGA side and a chip side, a cooler, a load frame attached to the substrate and formed to define an aperture in which the cooler is removably disposable, a spring clamp removably attachable to the load frame and configured to apply force from the load frame to the cooler such that the substrate and the cooler are urged together about the semiconductor and a load assembly device configured to urge the load frame and the LGA interposer together.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Colgan, Evan G Chestnut Ridge, US 140 2839
Gaynes, Michael A Vestal, US 118 1540
Zitz, Jeffrey A Poughkeepsie, US 53 606

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