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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

• SUMITOMO BAKELITE CO., LTD.

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
• C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Kotani, Takahiro	Tochigi, JP	11	53
Maeda, Masakatsu	Tochigi, JP	58	481
Nishitani, Yoshinori	Tochigi, JP	14	33
Seki, Hidetoshi	Tochigi, JP	13	54
Shigeno, Kazuya	Tochigi, JP	6	14

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Oct 15, 2025

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
April 15, 2014	US,8697803,B2   US8697803B2	GRANTED PATENT AS SECOND PUBLICATION
May 09, 2013	US,20130113122,A1   US20130113122A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 8697803

Epoxy resin composition and semiconductor device

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