Co-fired metal and ceramic composite feedthrough assemblies for use at least in implantable medical devices and methods for making the same
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United States of America Patent
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Apr 15, 2014
Grant Date -
Jan 6, 2011
app pub date -
Jun 4, 2010
filing date -
Jun 4, 2009
priority date (Note) -
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Abstract
A hermetic interconnect for medical devices is disclosed. In one embodiment, the interconnect includes platinum leads co-fired between alumina substrates to form a monolithic composite that is subsequently bonded into a titanium alloy flange. Both methodology for forming these interconnects as well as specific geometries and compositions are disclosed. Interconnects formed in this fashion enable significant reductions in overall size of the interconnect relative to the number of feedthrough leads as well as substantial improvements in robustness versus currently available technology.
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