Microelectronic assembly tolerant to misplacement of microelectronic elements therein
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United States of America Patent
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Apr 15, 2014
Grant Date -
Dec 19, 2013
app pub date -
Jun 18, 2012
filing date -
Jun 18, 2012
priority date (Note) -
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Abstract
A microelectronic assembly tolerant to misplacement of microelectronic elements therein may include a molded structure containing a plurality of microelectronic elements. Each microelectronic element has elements contacts having first and second dimensions in respective first and second directions that are transverse to each other, where the first dimension is at least twice the second dimension. In addition, the assembly may include a conductive redistribution layer including conductive vias extending through a dielectric layer to the element contacts of the respective microelectronic elements, where the conductive vias have a third dimension in a third direction and a fourth dimension in a fourth direction, and where the fourth direction is transverse to the third and first directions and the fourth dimension is greater than the third dimension.
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