Integrated circuit packaging system with interposer and method of manufacture thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 15, 2014
Grant Date -
Mar 21, 2013
app pub date -
Sep 20, 2011
filing date -
Sep 20, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an interposer having a top interposer surface over the substrate; attaching an interposer pad extension to the top interposer surface, the interposer pad extension having an extension contact surface and a lower contact surface, the surface area of the extension contact surface being smaller than the surface area of the lower contact surface; and forming a package encapsulation on the substrate, the interposer, and the interposer pad extension, the package encapsulation having a recess exposing the top interposer surface, the interposer pad extension embedded only in the package encapsulation.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully