Package assembly cleaning process using vaporized solvent

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8702871
APP PUB NO 20130048027A1
SERIAL NO

13221673

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Abstract

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A method includes generating a solvent-containing vapor that contains a solvent. The solvent-containing vapor is conducted to a package assembly to clean the package assembly. The solvent-containing vapor condenses to form a liquid on a surface of the package assembly, and flows off from the surface of the package assembly.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsiao, Yi-Li Hsin-Chu, TW 61 1029
Huang, Kuei-Wei Hsin-Chu, TW 69 1166
Hwang, Chien Ling Hsin-Chu, TW 114 2169
Jang, Bor-Ping Chu-Bei, TW 44 857
Liu, Chung-Shi Hsin-Chu, TW 772 10150
Wang, Lin-Wei Zhubei, TW 9 29

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