Polymer matrices for polymer solder hybrid materials
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United States of America Patent
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Apr 22, 2014
Grant Date -
Aug 11, 2011
app pub date -
Apr 20, 2011
filing date -
Feb 4, 2003
priority date (Note) -
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Abstract
Embodiments of the present invention provide various polymeric matrices that may be used as a binder matrix for polymer solder hybrid thermal interface materials. In alternative embodiments the binder matrix material may be phophozene, perfluoro ether, polyether, or urethane. For one embodiment, the binder matrix is selected to provide improved adhesion to a variety of interfaces. For an alternative embodiment the binder matrix is selected to provide low contact resistance. In alternative embodiments, polymeric materials containing fusible and non-fusible particles may be used in application where heat removal is desired and is not restricted to thermal interface materials for microelectronic devices.
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