Substrate treating apparatus with inter-unit buffers
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United States of America Patent
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Apr 29, 2014
Grant Date -
Jan 2, 2014
app pub date -
Aug 28, 2013
filing date -
Nov 30, 2007
priority date (Note) -
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Abstract
The invention provides coating units, heat-treating units, and a first main transport mechanism for transporting substrates to each of these treating units. The substrates are transferred from the first main transport mechanism to a second main transport mechanism through a receiver. When a substrate cannot be placed on the receiver, this substrate is placed on a buffer. Thus, the first main transport mechanism can continue transporting other substrates. The other substrates in the treating units are transported between the treating units without delay, to receive a series of treatments including coating treatment and heat treatment as scheduled. This prevents lowering of the quality of treatment for forming film on the substrates.
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