Polishing composition

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United States of America Patent

PATENT NO 8709278
APP PUB NO 20110121224A1
SERIAL NO

13003366

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Abstract

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A polishing composition that allows polishing speed to be increased and surface roughness to be reduced is provided. The polishing composition according to the present invention includes a compound including at least an oxyethylene group or an oxypropylene group in a block polyether represented by the following general formula (1), a basic compound, and abrasives: >N—R—N< (1) where R represents an alkylene group expressed as CnH2n and “n” is an integer not less than 1.

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Patent Owner(s)

Patent OwnerAddress
NITTA HAAS INCORPORATEDOSAKA-SHI OSAKA 556-0022

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsushita, Takayuki Kyoto, JP 17 134
Sugita, Noriaki Kyoto, JP 7 13

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