Liquid low temperature injection molding process
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 29, 2014
Grant Date -
Jan 25, 2007
app pub date -
Jul 21, 2005
filing date -
Jul 21, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The molding method of the invention is a low-temperature, liquid-phase, injection molding process using an externally heated mold. This molding process is ideally suited for production of limited quantities of molded parts, as comparatively low cost molds can be used. The molding composition used in the invention is a mixture of a carrier and binder component and a powdered polyethylene component. The carrier and binder component can be a very low density polyethylene, petroleum jelly, hydrocarbon waxes, liquid hydrocarbon oils, or mixtures thereof. The powdered polyethylene component is finely subdivided polyethylene, preferably ultra high molecular weight, having a low melt index, at least no greater than 30. The carrier and binder component is used in sufficient quantity to provide a thixotropic mixture with a consistency of toothpaste, typically having a stirred viscosity up to 30,000 centipoise at the injection temperature of the molding process. Since the process utilizes a mold which is externally heated, it can be controlled to provide minimal heating of the core of the part, thereby permitting one to incorporate components within the part without damage to temperature sensitive elements in the components.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully