Light-emitting device package and method of manufacturing the same
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United States of America Patent
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Apr 29, 2014
Grant Date -
Jun 28, 2012
app pub date -
Dec 6, 2011
filing date -
Dec 28, 2010
priority date (Note) -
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Abstract
A light-emitting device package uses a metal layer as a reflective region and includes a light-emitting device chip and an electrode pad that are disposed on an insulating layer. In addition, the electrode pad and an electrode pattern of a printed circuit board are connected to each other by an electrode pattern formed of conductive ink. A method of manufacturing a light-emitting device package includes forming an insulating layer on a metal layer, and bonding a light-emitting device chip and an electrode pad on the insulating layer. The electrode pad and a printed circuit board are connected to each other by conductive ink.
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