SOI-based CMUT device with buried electrodes
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United States of America Patent
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May 6, 2014
Grant Date -
Apr 12, 2012
app pub date -
Oct 12, 2011
filing date -
Oct 12, 2010
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Abstract
A multi-layer stacked micro-electro-mechanical (MEMS) device that acts as a capacitive micromachined ultrasonic transducer (CMUT) with a hermetically sealed device cavity formed by a wafer bonding process with semiconductor and insulator layers. The CMUT design uses a doped Si SOI and wafer bonding fabrication method, and is composed of semiconductor layers, insulator layers, and metal layers. Conventional doped silicon may be used for electrode layers. Other suitable semi-conductor materials such as silicon carbide may be used for the electrode layers. The insulator may be silicon oxide, silicon nitride or other suitable dielectric.
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