Probe devices formed from multiple planar layers of structural material with tip regions formed from one or more intermediate planar layers
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United States of America Patent
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May 6, 2014
Grant Date -
Mar 15, 2012
app pub date -
Oct 3, 2011
filing date -
Feb 4, 2003
priority date (Note) -
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Abstract
Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, methods are used to form probe structures from a plurality of planar multi-material layers wherein the probe structures include a contact tip and a compliant body with the compliant body formed from at least one material that is different from the tip material and wherein compliant body provides for elastic compression of the probe in a plane of primary motion during use and wherein during formation a stacking direction of the plurality of layers is perpendicular to the plane of primary motion.
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