Cutting element and a method of manufacturing a cutting element
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 13, 2014
Issued Date -
N/A
app pub date -
Nov 23, 2009
filing date -
Nov 24, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present disclosure relates in one aspect to a cutting element comprising a substrate and a cutting layer disposed on a surface of the substrate. The cutting layer comprises an ultra hard material. The substrate comprises tungsten carbide and a metal binder. The substrate has a magnetic saturation value in the range of from 80% to less than 85%. In another aspect, the magnetic saturation value may increase within the substrate along a gradient, wherein proximal to the interface with the cutting layer, the substrate has a magnetic saturation value in the range of from 80% to less than 85%. Also included are drill bits incorporating such cutting elements. Additionally, the present disclosure relates to methods of manufacturing cutting elements.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully