Semiconductor device support for bonding
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United States of America Patent
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May 13, 2014
Grant Date -
Sep 1, 2011
app pub date -
Nov 19, 2009
filing date -
Nov 13, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
In one embodiment, a support structure comprises a base, a compliant layer, and a protective layer which is used to secure a semiconductor device, such as a lead-frame, to a window clamp during a bonding process. The compliant layer distributes even loading over the surface of the semiconductor device while clamped. In other embodiments, the compliant layer may be segmented into individual portions corresponding with openings in the window clamp. The window clamp may also have a compliant layer and a protective layer and may be used with or without a compliant layer on the support structure. Features on the protective layer may be included to support structures of the semiconductor device.
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