Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
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United States of America Patent
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May 13, 2014
Grant Date -
Feb 7, 2013
app pub date -
Oct 11, 2012
filing date -
Aug 8, 2006
priority date (Note) -
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Abstract
A circuit material, comprising a conductive metal layer or a dielectric circuit substrate layer and an adhesive layer disposed on the conductive metal layer or the dielectric substrate layer, wherein the adhesive comprises a poly(arylene ether) and a polybutadiene or polyisoprene polymer.
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