On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations
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United States of America Patent
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May 13, 2014
Grant Date -
Jun 14, 2012
app pub date -
Feb 17, 2012
filing date -
Mar 31, 2008
priority date (Note) -
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Abstract
Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface.
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