Method of manufacturing a semiconductor device

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United States of America Patent

PATENT NO 8729548
APP PUB NO 20100157165A1
SERIAL NO

12718149

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Abstract

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The present invention supplies a manufacturing method of a semiconductor device, which includes a non-contact inspection process capable of confirming if a circuit or circuit element formed on an array substrate is normally performed and can decrease a manufacturing cost by eliminating wastes to keep a defective product forming.

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Patent Owner(s)

  • SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hiroki, Masaaki Kanagawa, JP 258 8537
Yamazaki, Shunpei Tokyo, JP 7287 226692

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