Conformal shield on punch QFN semiconductor package
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United States of America Patent
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May 20, 2014
Grant Date -
N/A
app pub date -
May 3, 2011
filing date -
Mar 4, 2009
priority date (Note) -
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Abstract
In accordance with the present invention, there is provided a punch quad flat no leads (QFN) semiconductor package including a leadframe wherein the leads of the leadframe are selectively half-etched so that only one or more prescribed leads may be electrically connected to a conformal shield applied to the package body of the semiconductor package. The conformal shield may be electrically connected to the exposed lead(s) alone, or in combination with one or more tie bars of the leadframe. In one embodiment, outer end portions of the top surfaces of the leads of the semiconductor package are alternately exposed and non-exposed, with the non-exposed leads including a top side half-etch which causes the same to be effectively covered by the package body of the semiconductor package.
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