Method of packaging a sensor
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United States of America Patent
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-
May 27, 2014
Grant Date -
Sep 2, 2010
app pub date -
May 19, 2010
filing date -
Mar 21, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An improved method of packaging a sensor is provided. The method includes the step of affixing a tuning fork to a platform. The tuning fork includes tines comprising one or more surfaces, with each tine further comprising an electrode and a piezoelectric material. An application specific integrated circuit (ASIC) is affixed to the platform. Electrical communication between the ASIC and the electrode of each tine is established for providing stimulus to the tuning fork and for receiving a response signal from the tuning fork. A protective layer is applied to cover the platform and a portion of the tuning fork while maintaining a portion of a surface of each tine free from the protective layer such that the surface can displace the fluid in contact therewith.
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