Bonding inspection structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8736083
APP PUB NO 20100163869A1
SERIAL NO

12431766

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Abstract

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A bonding inspection structure is provided. The bonding inspection structure includes at least a elastic bump located on a substrate. At least an opening is formed in the top portion of the elastic bump. An inspection area of the top portion of the elastic bump is larger than an area of the opening.

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Patent Owner(s)

Patent OwnerAddress
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEHSINCHU
AU OPTRONICS CORPORATIONNO 1 LI-HSIN ROAD 2 SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU
HANNSTAR DISPLAY CORPORATIONTAIPEI CITY
CHUNGHWA PICTURE TUBES LTDNO 22 SEC 3 CHUNG SHAN N RD TAIPEI ROC
CHI MEI OPTOELECTRONICS CORPORATIONTAIWAN 74147
TAIWAN TFT LCD ASSOCIATIONRM 282 BLDG 15 195 SEC 4 CHUNG HSING RD CHUTUNG HSINCHU

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
An, Chao-Chyun Hsinchu, TW 7 75
Lee, Hsiao-Ting Nantou County, TW 2 6
Yang, Sheng-Shu Hsinchu, TW 16 120

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