Method and electrode for defining and replicating structures in conducting materials
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United States of America Patent
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Jun 3, 2014
Grant Date -
Sep 13, 2012
app pub date -
Mar 12, 2012
filing date -
Jun 15, 2001
priority date (Note) -
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Abstract
The present invention concerns an electrochemical pattern replication method, ECPR, and a construction of a conductive electrode for production of applications involving micro and nano structures. An etching or plating pattern, which is defined by a conductive electrode, a master electrode, is replicated on an electrically conductive material, a substrate. The master electrode is put in close contact with the substrate and the etching/plating pattern is directly transferred onto the substrate by using a contact etching/plating process. The contact etching/plating process is performed in local etching/plating cells, that are formed in closed or open cavities between the master electrode and the substrate.
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