Housing assembly to enclose and ground an electrical subassembly

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United States of America Patent

PATENT NO 8742255
APP PUB NO 20130135797A1
SERIAL NO

13307950

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A housing assembly to enclose an electrical subassembly includes a housing formed from a conductive polymer. The housing has a cavity sized to receive an electronic sub-assembly therein. A conductive boss is insert-molded into the housing in conductive contact with the housing. A conductive bracket is fastened to the boss in conductive connection with the boss and the housing to support and electrically ground the housing.

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Patent Owner(s)

  • LEAR CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Daftuar, Dilip West Bloomfield, US 6 65
Menzies, David Linden, US 76 913
Pavlovic, Slobodan Novi, US 90 1685
Sharaf, Nadir Bloomfield Township, US 25 345

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