Three-dimensional hot spot localization
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United States of America Patent
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Jun 3, 2014
Grant Date -
Dec 8, 2011
app pub date -
Jun 8, 2011
filing date -
Jun 8, 2010
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Abstract
A non-destructive approach for the 3D localization of buried hot spots in electronic device architectures by use of Lock-in Thermography (LIT). The 3D analysis is based on the principles of thermal wave propagation through different material layers and the resulting phase shift/thermal time delay. With more complex multi level stacked die architectures it is necessary to acquire multiple LIT results at different excitation frequencies for precise hot spot depth localization. Additionally, the use of multiple time-resolved thermal waveforms, measured in a minimized field of view on top of the hot spot location, can be used to speed up the data acquisition. The shape of the resulting waveforms can be analyzed to further increase the detection accuracy and confidence level.

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Patent Owner(s)
Patent Owner | Address | |
---|---|---|
FRAUNHOFER-GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E V | HANSASTRASSE 27 C MUNCHEN 80686 | |
DCG SYSTEMS INC | 45900 NORTHPORT LOOP EAST FREMONT CA 94538 |
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Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Altmann, Frank | Halle, DE | 5 | 39 |
Deslandes, Herve | Sunnyvale, US | 12 | 64 |
Schlangen, Rudolf | San Francisco, US | 7 | 53 |
Schmidt, Christian | Halle, DE | 142 | 944 |
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