Memory device having a dielectric containing dysprosium doped hafnium oxide
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United States of America Patent
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Jun 3, 2014
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app pub date -
Jul 3, 2013
filing date -
Feb 8, 2005
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Abstract
The use of a monolayer or partial monolayer sequencing process, such as atomic layer deposition, to form a dielectric layer of hafnium oxide doped with dysprosium and a method of fabricating such a combination produces a reliable structure for use in a variety of electronic devices. The dielectric structure can include hafnium oxide on a substrate surface followed by dysprosium oxide, and repeating to form a thin laminate structure. A dielectric layer of dysprosium doped hafnium oxide may be used as the gate insulator of a MOSFET, as a capacitor dielectric in a DRAM, as a tunnel gate insulator in flash memories, or as a dielectric in NROM devices.
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