Process for improving package warpage and connection reliability through use of a backside mold configuration (BSMC)
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United States of America Patent
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Jun 3, 2014
Grant Date -
Nov 24, 2011
app pub date -
Sep 15, 2010
filing date -
May 20, 2010
priority date (Note) -
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Abstract
A backside mold configuration (BSMC) process for manufacturing packaged integrated circuits includes applying a mold compound to a side of a packaging substrate opposite an attached die. The mold compound is deposited on a dielectric (such as photo resist). The mold compound and dielectric are patterned after coupling a die to the packaging substrate to expose a contact pad of the packaging substrate. After patterning the mold compound and dielectric, a packaging connection is coupled to contact pads through the mold compound and dielectric. The mold compound surrounding the packaging connection reduces warpage of the packaging substrate during processing. Additionally, patterning the dielectric after attaching the die improves reliability of the packaging connection.
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