Ultrasonic bonding systems and methods of using the same
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United States of America Patent
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Jun 10, 2014
Grant Date -
Feb 20, 2014
app pub date -
Oct 22, 2013
filing date -
Mar 31, 2010
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool for bonding a conductive bonding material to a workpiece. The ultrasonic bonding system also includes a pressing member adapted to press against the workpiece, the pressing member being supported by the bond head assembly and being moveable with respect to the bond head assembly independent of the bonding tool. The pressing member includes a body portion and a plurality of pressing elements extending below the body portion, the pressing elements being configured to contact the workpiece.
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