Epoxy resin composition, and prepreg and printed circuit board using the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8748513
APP PUB NO 20110253433A1
SERIAL NO

12836871

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including amino-triazine-novolac resin and diaminodiphenylsulfone mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
TAIWAN UNION TECHNOLOGY CORPORATIONNO 803 PO AI ST ZHUBEI CITY HSINCHU COUNTY TAIWAN R O C

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Hsien-Te Jhubei, TW 54 134

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Dec 10, 2025
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00