Semiconductor device and method of manufacturing semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8749033
APP PUB NO 20120119338A1
SERIAL NO

13200944

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Abstract

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A semiconductor chip includes a magnetic storage device and includes an electrode pad on a first face. The semiconductor chip is coated with a magnetic shield layer in a state in which at least the electrode pad is exposed. The semiconductor chip is mounted on an interconnect substrate through a bump. At least one of the semiconductor chip and the interconnect substrate includes a convex portion, and the bump is disposed over the convex portion.

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Patent Owner(s)

  • RENESAS ELECTRONICS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ushiyama, Yoshitaka Kanagawa, JP 7 25
Watanabe, Takahito Kanagawa, JP 29 91
Yamamichi, Shintaro Kanagawa, JP 90 2228

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