Method of adjustment during manufacture of a circuit having a capacitor

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8756778
APP PUB NO 20110298554A1
SERIAL NO

13159244

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A method of adjustment during manufacture of a capacitance of a capacitor supported by a substrate, the method including the steps of: a) forming a first electrode parallel to the surface of the substrate and covering it with a dielectric layer; b) forming, on a first portion of the dielectric layer, a second electrode; c) measuring the electrical signal between the first electrode and the second electrode, and deducing therefrom the capacitance to be added to obtain the desired capacitance; d) thinning down a second portion of the dielectric layer, which is not covered by the second electrode, so that the thickness of this second portion is adapted to the forming of the deduced capacitance; and e) forming a third electrode on the thinned-down portion and connecting it to the second electrode.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
STMICROELECTRONICS SAMONTROUGE2011

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bar, Pierre Grenoble, FR 25 39
Joblot, Sylvain Valbonne, FR 20 62
Petit, David Fontaine, FR 11 27

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
2005/0070,127 METHOD FOR ADJUSTING CAPACITANCE OF AN ON-CHIP CAPACITOR 2 2003
 
LUCENT TECHNOLOGIES INC. (1)
* 6317948 Embedded thin film passive components 46 1999
 
Ultrasource, Inc. (2)
* 6761963 Integrated thin film capacitor/inductor/interconnect system and method 21 2001
* 7327582 Integrated thin film capacitor/inductor/interconnect system and method 6 2005
 
CHEMTRON RESEARCH LLC (1)
* 7100277 Methods of forming printed circuit boards having embedded thick film capacitors 10 2004
 
STMICROELECTRONICS SA (2)
* 8397360 Method for manufacturing a monolithic oscillator with bulk acoustic wave (BAW) resonators 2 2010
* 8587921 Method of adjustment on manufacturing of a circuit having a resonant element 2 2010
 
KABUSHIKI KAISHA TOSHIBA (2)
* 4572843 Method for producing a capacitor with precise capacitance 32 1985
* 7490390 Method of manufacturing a voltage controlled oscillator 14 2007
 
KYOCERA MITA CORPORATION (1)
2005/0082,636 Tunable thin film capacitor 70 2004
 
Asia Pacific Microsystems, Inc. (1)
2003/0205,948 Film bulk acoustic device with integrated tunable and trimmable device 26 2002
 
MOTOROLA SOLUTIONS, INC. (1)
* 7444727 Method for forming multi-layer embedded capacitors on a printed circuit board 2 2006
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

  • No Forward Cites to Display

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Dec 24, 2017
7.5 Year Payment $3600.00 $1800.00 $900.00 Dec 24, 2021
11.5 Year Payment $7400.00 $3700.00 $1850.00 Dec 24, 2025
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00