Method for manufacturing a read head having conductive filler in insulated hole through substrate
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United States of America Patent
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Jun 24, 2014
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N/A
app pub date -
Mar 21, 2012
filing date -
Nov 4, 2009
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Abstract
A method for manufacturing a read head includes the step of depositing a conductive filler into a plurality of holes that extend through a wafer. Each of the holes extends from a wafer top surface to a wafer bottom surface. Each of the holes includes an inner surface that includes an insulative layer. The method further includes the steps of fabricating a read transducer on the wafer top surface, and depositing a plurality of electrically conductive leading connection pads on the wafer bottom surface. The plurality of electrically conductive leading connection pads are in electrical contact with the conductive filler.
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