Heat dissipation methods and structures for semiconductor device
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United States of America Patent
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Jun 24, 2014
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N/A
app pub date -
Aug 13, 2013
filing date -
Dec 27, 2006
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Abstract
A semiconductor device with efficient heat dissipating structures is disclosed. The semiconductor device includes a first semiconductor chip that is flip-chip mounted on a first substrate, a heat absorption portion that is formed between the first semiconductor chip and the first substrate, an outer connection portion that connects the first semiconductor chip to an external device and a heat conduction portion formed between the heat absorption portion and the outer connection portion to dissipate heat generated by the first semiconductor chip.
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