Integrated circuit packaging system with electrical interface and method of manufacture thereof
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United States of America Patent
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Jun 24, 2014
Grant Date -
Nov 8, 2012
app pub date -
May 5, 2011
filing date -
May 5, 2011
priority date (Note) -
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Abstract
A method of manufacture of an integrated circuit packaging system includes: forming an isolated contact having a contact protrusion, the contact protrusion having a lower protrusion surface, an upper protrusion surface, and a protrusion sidewall; forming a die paddle, adjacent to the isolated contact, having a die paddle protrusion, the die paddle protrusion having a lower die protrusion surface, an upper die protrusion surface, and a die protrusion sidewall; depositing a contact pad on the contact protrusion; depositing a die paddle pad on the die paddle protrusion; coupling an integrated circuit die to the contact protrusion; and molding an encapsulation on the integrated circuit die.
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