Controlled collapse chip connection (C4) structure and methods of forming
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United States of America Patent
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Jul 1, 2014
Grant Date -
Feb 13, 2014
app pub date -
Aug 8, 2012
filing date -
Aug 8, 2012
priority date (Note) -
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Abstract
Aspects of the present invention relate to a controlled collapse chip connection (C4) structures. Various embodiments include a method of forming a controlled collapse chip connection (C4) structure. The method can include: providing a precursor structure including: a substrate, a dielectric over the substrate, the dielectric including a plurality of trenches exposing a portion of the substrate, and a metal layer over the dielectric and the portion of the substrate in each of the plurality of trenches, forming a resist layer over the metal layer, forming a rigid liner over a surface of the resist layer and the metal layer, and forming solder over the rigid liner between portions of the resist layer.
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