Through-hole-vias in multi-layer printed circuit boards

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United States of America Patent

PATENT NO 8766107
APP PUB NO 20120193135A1
SERIAL NO

13446727

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Abstract

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Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of making and using such PCBs that include layers of laminate; at least one via hole traversing the layers of laminate, and a via conductor contained within the via hole, the via conductor comprising a used portion and an unused portion, the via conductor comprising copper coated with a metal having a conductivity lower than the conductivity of copper.

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Patent Owner(s)

  • LENOVO INTERNATIONAL LIMITED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cases, Moises Austin, US 88 1006
Kim, Tae Hong Round Rock, US 102 384
Mandrekar, Rohan U Austin, US 25 94
Sherali, Nusrat I Austin, US 4 27

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