Integrated circuit packaging system with flip chip and method of manufacture thereof
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United States of America Patent
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Jul 1, 2014
Grant Date -
Jun 2, 2011
app pub date -
Dec 2, 2009
filing date -
Dec 2, 2009
priority date (Note) -
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Abstract
A method of manufacture of an integrated circuit packaging system includes: forming external interconnects having bases of a first thickness and tips of a second thickness extending inwardly directly toward each other; connecting a first circuit device between the tips; attaching a second circuit device to the first circuit device with a combined thickness of the first circuit device and the second circuit device less than the first thickness; and forming an encapsulation of the first thickness between the bases and over the tips.
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