Methods of making and attaching TSP material for forming cutting elements, cutting elements having such TSP material and bits incorporating such cutting elements
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United States of America Patent
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Jul 8, 2014
Grant Date -
Nov 11, 2010
app pub date -
May 6, 2010
filing date -
May 6, 2009
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Abstract
A method of forming one or more TSP compacts is provided. The method includes placing one or more TSP material layers in an enclosure and surrounding each TSP material layer with at least one of a pre-sintered tungsten carbide powder, pre-cemented tungsten carbide powder, tungsten carbide powder, or partially sintered tungsten carbide substrates. The method also includes exposing the enclosure to a high temperature high pressure process wherein the at least one of a pre-sintered tungsten carbide powder, pre-cemented tungsten carbide powder, tungsten carbide powder, or partially sintered tungsten carbide substrates bond to the TSP material layers forming a stack of TSP material layers including the TSP material layers one over the other with tungsten carbide bonded to each of the TSP material layers and encapsulating each of the TSP material layers.
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