Edge protection seal for bonded substrates
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United States of America Patent
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Jul 8, 2014
Grant Date -
Jul 4, 2013
app pub date -
Feb 28, 2013
filing date -
Oct 29, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A dielectric material layer is deposited on exposed surfaces of a bonded structure that includes a first substrate and a second substrate. The dielectric material layer is formed on an exposed planar surface of a second substrate and the entirety of peripheral sidewalls of the first and second substrates. The dielectric material layer can be formed by chemical vapor deposition, atomic layer deposition, or plasma induced deposition. Further, the dielectric material layer seals the entire periphery of the interface between the first and second substrates. If a planar portion of the dielectric material layer can be removed by planarization to facilitate thinning of the bonded structure, the remaining portion of the dielectric material layer can form a dielectric ring.
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