Exposure mask and method for manufacturing same and method for manufacturing semiconductor device
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United States of America Patent
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Jul 8, 2014
Grant Date -
Sep 27, 2012
app pub date -
Jun 8, 2012
filing date -
Feb 6, 2009
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An exposure mask includes: an insulative substrate; a light reflecting film provided on the substrate; a light absorbing film provided on the light reflecting film and forming a pattern in a center region on the substrate; and an interconnect provided on the substrate, the light reflecting film and the light absorbing film not being provided in a frame-shaped region surrounding the center region, and the interconnect being placed so that a portion of a laminated film composed of the light reflecting film and the light absorbing film located inside the frame-shaped region is electrically connected to a portion of the laminated film located outside the frame-shaped region.
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