System and method for increasing die yield
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United States of America Patent
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Jul 8, 2014
Grant Date -
Nov 10, 2005
app pub date -
Dec 18, 2003
filing date -
Sep 15, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present invention systems and methods facilitate increased die yields by flexibly changing the operational characteristics of functional components in an integrated circuit die. The present invention system and method enable integrated circuit chips with defective functional components to be salvaged. Defective functional components in the die are disabled in a manner that maintains the basic functionality of the chip. A chip is tested and a functional component configuration process is performed on the chip based upon results of the testing. If an indication of a defective functional component is received, the functional component is disabled. Workflow is diverted from disabled functional components to enabled functional components.
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