Polishing method and method for fabricating semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8778802
APP PUB NO 20070293047A1
SERIAL NO

11802532

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Abstract

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A polishing method includes causing a polishing pad arranged on a turn table to rotate together with the turn table, and polishing a surface of a substrate by using the rotating polishing pad while supplying a chemical fluid to a surface of the polishing pad on a fore side of the substrate from an oblique direction with respect to the surface of the polishing pad.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukushima, Dai Kanagawa, JP 43 296
Minamihaba, Gaku Kanagawa, JP 96 925
Yano, Hiroyuki Kanagawa, JP 196 3126

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