Optical proximity sensor package with molded infrared light rejection barrier and infrared pass components
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United States of America Patent
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Jul 15, 2014
Grant Date -
Dec 30, 2010
app pub date -
Jun 30, 2009
filing date -
Jun 30, 2009
priority date (Note) -
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Abstract
An optical proximity sensor is provided that comprises an infrared light emitter an infrared light detector, a first molded optically transmissive infrared light pass component disposed over and covering the light emitter and a second molded optically transmissive infrared light pass component disposed over and covering the light detector. Located in-between the light emitter and the first molded optically transmissive infrared light pass component, and the light detector and the second molded optically transmissive infrared light pass component is a substantially optically non-transmissive infrared light barrier component. The infrared light barrier component substantially attenuates or blocks the transmission of undesired direct, scattered or reflected light between the light emitter and the light detector, and thereby minimizes optical crosstalk and interference between the light emitter and the light detector.
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