Integrated circuit packaging system with interposer shield and method of manufacture thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8779562
APP PUB NO 20120241921A1
SERIAL NO

13071228

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of manufacture of an integrated circuit packaging system includes: providing a bottom substrate; attaching a first integrated circuit die to the bottom substrate; forming an interposer including: forming an intermediate substrate; forming a shield on the intermediate substrate; and applying a wire-in-film adhesive to the shield; and attaching the interposer to the first integrated circuit die with the wire-in-film adhesive.

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTE.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, SeongMin Seoul, KR 48 748
Mun, SeongHun Incheon, KR 7 92
Song, Sungmin Inchon, KR 23 408

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