Integrated circuit mounting system with paddle interlock and method of manufacture thereof

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United States of America Patent

PATENT NO 8779565
APP PUB NO 20120146192A1
SERIAL NO

12967223

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Importance

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Abstract

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A method of manufacture of an integrated circuit mounting system includes: providing a die paddle with a component side having a die mount area and a recess with more than one geometric shape; applying an adhesive on the die mount area and in a portion of the recess; and mounting an integrated circuit device with an inactive side directly on the adhesive.

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTE.

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bathan, Henry Descalzo Singapore, SG 113 950
Do, Byung Tai Singapore, SG 246 5097
Han, Byung Joon Singapore, SG 75 2483
Trasporto, Arnel Senosa Singapore, SG 61 486

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